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Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness

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Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness

Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness
Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness

Large Image :  Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness Get Best Price

Product Details:
Place of Origin: China
Brand Name: OEM and ODM
Certification: UL,RoHS, CE
Model Number: SL81023S004
Payment & Shipping Terms:
Minimum Order Quantity: 1pc
Price: Negotiable
Packaging Details: ESD package
Delivery Time: 5-7 days
Payment Terms: T/T, Western Union, MoneyGram,Paypal
Supply Ability: 100000pcs per day
Detailed Product Description
Packaging Details: Bubble Wrap Layer: 4 Layer
Board Thickness: 1.6mm Features 1: Gerber/PCB File Needed
Features 2: 100% E-test Features 3: Quality 2 Years Guarantee
High Light:

smt electronic assembly

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smt pcba

Access Control Electronic SMT PCB Assembly 4 Layers Fast Delivery

 

 

Our production capacity

 

PCB Item Manufacture Capacity
Layer Counts 1--20L
Base Material FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)
Material Thickness(mm) 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
Max board size(mm) 1200x400mm
Board Outline Tolerance ±0.15mm
Board Thickness 0.4mm--3.2mm
Thickness Tolerance ±8%
Minimum line/space 0.1mm
Min Annular Ring 0.1mm
SMD Pitch 0.3mm
Holes  
Min Hole Size(mechanical) 0.2mm
Min Hole Size(laser hole) 0.1mm
Hole Size Tol (+/-) PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol ±0.075mm
Plating  
HASL/LF HAL 2.5um
Immersion Gold Nickel 3-7um Au:1-5u''
Surface Finish HAL,ENIG,Plated Gold,Immersion Gold,OSP
Copper  
Copper Weight 0.5--6oz
Color  
Solder mask Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Silk screen White, Black, Blue,Yellow
Acceptable File Format Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
Certificate ROSH,ISO9001,UL

 

 

PCB Assembly Capability

 

Stencil Size 736x736mm
Minimum IC Pitch 0.2mm
Maximum PCB size 1200x 500mm
Minimum PCB thickness 0.25mm
Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size: 74x74mm
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
Volume: One piece to low volume production quantities
Low cost first article builds
Schedule deliveries
Assembly type: Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly
Components type: Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch
Parts procurements: Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest
Solder type: Leaded
Lead-free/ROHS compliant
Other capabilities: Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.

 

 

PCBA Picture

 

Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness 0

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Ms Xia

Tel: +8613590384973

Send your inquiry directly to us