Send Message
Shenzhen Shinelink Technology Ltd 86--13590384973 sandy@szshinelink.com
TG170 FR4 BGA Gold Finger PCB Circuit Board Assembly PCBA Prototype Service

TG170 FR4 BGA Gold Finger PCB Circuit Board Assembly PCBA Prototype Service

  • High Light

    pcb board assembly

    ,

    pcb assembly services

  • Based Material
    TG170 FR4
  • Certificate
    UL
  • Board Thickness
    1.6mm
  • Features 1
    Gerber/PCB File Needed
  • Features 2
    100% E-test
  • Features 3
    Quality 2 Years Guarantee
  • Place of Origin
    China
  • Brand Name
    OEM/ODM
  • Certification
    UL,RoHS, CE
  • Model Number
    SL80224S002
  • Minimum Order Quantity
    1pc
  • Price
    Negotiable
  • Packaging Details
    ESD package
  • Delivery Time
    5-7 days
  • Payment Terms
    T/T, Western Union, MoneyGram,Paypal
  • Supply Ability
    1000pcs per day

TG170 FR4 BGA Gold Finger PCB Circuit Board Assembly PCBA Prototype Service

TG170 FR4 BGA Gold Finger PCB Circuit Board Assembly PCBA Prototype Service​ 
 

Shinelink, the Most professional R&D and OEM Manufacturer in China!
 
Fast Delivery
PCB/PCBA Products 12Hours the fastest.
 
Provide the whole industry chain service
From the pcb board, components purchase to pcb assembly,function testing and casing assembly.
 
Engineer Support
We could provide the suggestion of the pcb design file and function testing method improvement.

 

 

Files Requested For PCB Assembly Quotation


---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required

 

 

Shinelink kinds PCBA Products

 

TG170 FR4 BGA Gold Finger PCB Circuit Board Assembly PCBA Prototype Service 0
 

Feature

 

Number of Layer 1 - 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 - 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP

 


PCB Assembly Capabilities
 

Turnkey PCBA PCB+components sourcing+assembly+package
Assembly details SMT and Thru-hole, ISO lines
Lead Time Prototype: 15 work days. Mass order: 20~25 work days
Testing on products Flying Probe Test, X-ray Inspection, AOI Test, functional test
Quantity Min quantity: 1pcs. Prototype, small order, mass order, all OK
Files we need PCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB panel Size Min size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder Type Water Soluble Solder Paste, RoHS lead free
Components details Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component package Cut Tape,Tube,Reels,Loose Parts
PCB assembly
process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

 TG170 FR4 BGA Gold Finger PCB Circuit Board Assembly PCBA Prototype Service 1
 
Advantage
 
1. ISO& UL certified third-party testing and high-quality technical service team.
2. Available and immediate delivery.
3. Producing capacity: 20,000sq meter/month.
4. Competitive price with no MOQ.
 

FAQ:

1. How do O-Leading ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
1.4.Dedicated quality assurance team with failure case analysis process
1.5.Continuous staff training and education


2. How do O-Leading keep your price competitive?

Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled or quadrupled; Chinese currency RMB had appreciated 31% over US dollar; And our labor cost also increased significantly.

However, O-Leading have kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes and improving efficiency. Our prices are very competitive in the industry at the same quality level.

We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an edgeon cost and quality.


3. What kinds of boards can O-Leading process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


4. What data are needed for PCB & PCBA production?

4.1 BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
4.2 PCB Gerber files.
4.3 PCB fabrication drawing and PCBA assembly drawing.
4.4 Test procedures.
4.5 Any mechanical restrictions such as assembly height requirements.


5. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.