Verious types of customizable rigid flexible pcb with quick delivery
Shinelink Company has been an industry leading FPC manufacturer since 2004.
Main Products, Flex PCB (Flexible printed circuit), Rigid-Flex PCB and MCPCB.
1. More than 12 years manufacturing experience in FPC field.
2. Focus on FPC this only product.No PCB production line.
3. Near 12000 square meters production base.
4. Caple technical personelconsist of some industry experts and elites who are working for more than 10 years in FPC field.
5. Many advanced and complete production equipments for FPC Manufacturing.
6. All manufacturing process is only made in our plant.
7. Through the professional training, our sales team could offer the clients with the quick answer to the technology question, and the most professional suggestion on the optimization of artwork design. It would help to better improve the project rationality and decrease the production cost, thereby providing with the best cost-effective process plan.
8. All the raw materials passed ROHS certification through SGS and flammability UL94 V-0,inculding FCCL and Polyimide Coverlay Film.
FPC Process Capability
|Items||FPC Process Capability|
|Number of Layers||Single Sided, Double Sided, Multilayer, Rigid-flex PCB|
|Based Material||PI, PET|
|Largest Board Area||406mm X 610mm/16"X 24",The largest could be 7 meters length in Single sided Flexible Printed Circuit Board|
|Minimum Hole Diameter of Mechanical Drilling||0.2mm/0.008"|
|Minimum Hole Diameter of Laser Drilling||0.075mm/0.03"|
|Minimum Hole Diameter of Hole-punching||0.50mm/0.02"|
|Tolerance of Plated Through Hole||+/-0.05mm/±0.02"|
|Minimum Line Width||0.075mm/0.003"|
|Minimum Line Spacing||0.075mm/0.003"|
|Peel Strength||1.2kg f/cm|
|Shape Processing||Die Stamping, Cutting, Laser Prototyping|
|Appearance of Tolerance||+/-0.05mm/ +/-0.02"|
|Solder Mask Type||PI Solder Mask Coverlay Film or PET Solder Mask Covelay Film Lamination
|Multi-colored Liquid Photo-Imageable solder Mask Ink, Thermosetting Solder Mask Ink|
|Surface Treatment||Plating Tin, Immersion Tin, Plating Nickel Gold, ENIG (Electroless Nickel Immersion Gold),Immersion Nickel Gold, Chemical Nickel Gold,OSP( Organic Solderability Preservatives), Immersion Silver|
1. OEM services provided, Product and Package
2. Sample order is acceptable ,the order quantity is unrestricted.
3. Response to your inquiry within 24 hours.
4. After sending, we will track the products for you once every two days, until you get the products.
5. Professional sales team could answer any technical question at fastest speed and help you to solve any problem on design.
6. Supply the professional suggestion on design and usage.
1. Higher circuit density
2. Decreased Assembly Time and Costs.
3. Increased Heat Dissipation
4. A multi-layer flex circuit combines several single-sided or double-sided circuits with complex interconnections, shielding and/or surface mounted technologies in a multi-layer design.
5. Several copper layers separated encapsulated by dielectric layers. Metal layers are often connected by metalized thru-holes
6. The surface treatment is mostly ENIG, but it is acceptable for Plating Nickel-Gold, Plating Tin, Immersion Tin and OSP.
7. The multilayers may or may not be continuously laminated together throughout the production process. If your design needs require maximum flexibility, continuous lamination may not be appropriate.
1. Soldermask ink as soldermask layer, including Black, Red, Yellow and Green. Among then, Black one could be also used Black PI coverlay film.
2. FCCL material. Rolled Anneal Copper. But you could change it into Elctro-deposited copper.
3. Strong singal quality.
4. Excellence elctronic property and reliable dielectric performance.
5. Increased the reliablity in circuitry system.
6. Lighter weight than PCB, reduce the weight of final products.
7. High heat resisting property, in favor of increasing heart dissipation
8. Immersion Nickel Gold. Please note that it is not pure gold. Nickel could assist the gold to hard without adding more gold
9. Strong signal quality.
10.Widely used as chip of SIM cards and Smart IC card.
11. Materials thinkness. 18um copper, 25um PI, and 20um adhesive on FCCL, 12.5um PI and 15um adhesive on PI coverlay film. More options please view the below parameter lists.
|Specification of standard Polyimide film based coverlay|
|Specification||PI Flim Thickness (um)||Adhesive Thickness (um)|
|Specification of standard Haloger-free PI film based flexible copper clad laminate (3- layer FCCL)|
|Specification||Materials Thickness (um)|
|PI:Copper||PI Film||Copper Foil||Adhesive|
|0.5 mil:0.5 OZ||12.5||18||13|
|1 mil:0.5 OZ||25||18||20|
|1 mil:1 OZ||25||35||20|
|2 mil:1 OZ||50||35||20|
Packing and Delivery
1. Firstly hermetic plastic bag fill with products,
2. Then bubble sheet separates them,
3. Finally paper carton packing.
1. It would take 7-9 days to mufacture it after deposit received.Production time would depend on your drawing and process plan.
2. DHL,FedEx, UPS delivery. It is faster than vessel.Barely deliever it by vessel.