Detailed Specification of PCB Manufacturing
Number of Layer | 1 - 20 Layer |
Maximum Processing Area | 680 × 1000MM |
Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) |
4 Layer - 0.4MM ( 16 mil ) | |
6 Layer - 0.8MM ( 32 mil ) | |
8 Layer - 1.0MM ( 40 mil) | |
10 Layer - 1.1MM ( 44 mil ) | |
12 Layer - 1.3MM ( 52 mil ) | |
14 Layer - 1.5MM ( 59 mil ) | |
16 Layer - 1.6MM ( 63 mil ) | |
18 Layer - 1.8MM ( 71 mil ) | |
Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% | |
Twisting and Bending | ≤ 0.75%, Min: 0.5% |
Range of TG | 130 - 215 ℃ |
Impedance Tolerance | ± 10%, Min: ± 5% |
Hi-Pot Test | Max: 4000V/10MA/60S |
Surface Treatment | HASL, With Lead, HASL Free Lead |
Flash Gold, Immersion Gold | |
Immersion Silver, Immersion Tin | |
Gold Finger, OSP |
PCB Assembly Capabilities
Turnkey PCBA | PCB+components sourcing+assembly+package |
Assembly details | SMT and Thru-hole, ISO lines |
Lead Time | Prototype: 15 work days. Mass order: 20~25 work days |
Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test |
Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK |
Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) |
Components: Bill of Materials(BOM list) | |
Assembly: Pick-N-Place file | |
PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) |
Max size: 20*20 inches(500*500mm) | |
PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
Components details | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly process |
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |