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Shenzhen Shinelink Technology Ltd 86--13590384973 sandy@szshinelink.com

Shenzhen Shinelink Technology Ltd Capabilities Introduction

Shenzhen Shinelink Technology Ltd Capabilities Introduction

Detailed Specification of PCB Manufacturing

 

Number of Layer 1 - 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 - 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP

 

 

PCB Assembly Capabilities

 

Turnkey PCBA PCB+components sourcing+assembly+package
Assembly details SMT and Thru-hole, ISO lines
Lead Time Prototype: 15 work days. Mass order: 20~25 work days
Testing on products Flying Probe Test, X-ray Inspection, AOI Test, functional test
Quantity Min quantity: 1pcs. Prototype, small order, mass order, all OK
Files we need PCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB panel Size Min size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder Type Water Soluble Solder Paste, RoHS lead free
Components details Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component package Cut Tape,Tube,Reels,Loose Parts
PCB assembly
process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing