Fast Prototype SMT Circuit Board PCBA Assembly Green Soldermask With Parts Sourcing

PCB Item

Manufacture Capacity

Layer Counts

1--20L

Base Material

FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)

Material Thickness(mm)

0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2

Max board size(mm)

1200x400mm

Board Outline Tolerance

±0.15mm

Board Thickness

0.4mm--3.2mm

Thickness Tolerance

±8%

Minimum line/space

0.1mm

Min Annular Ring

0.1mm

SMD Pitch

0.3mm

Holes

Min Hole Size(mechanical)

0.2mm

Min Hole Size(laser hole)

0.1mm

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL/LF HAL

2.5um

Immersion Gold

Nickel 3-7um Au:1-5u''

Surface Finish

HAL,ENIG,Plated Gold,Immersion Gold,OSP

Copper

Copper Weight

0.5--6oz

Color

Solder mask

Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue

Silk screen

White, Black, Blue,Yellow

Acceptable File Format

Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000

Certificate

ROSH,ISO9001,UL

Stencil Size

736x736mm

Minimum IC Pitch

0.2mm

Maximum PCB size

1200x 500mm

Minimum PCB thickness

0.25mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Volume:

One piece to low volume production quantities
Low cost first article builds
Schedule deliveries

Assembly type:

Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly

Components type:

Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch

Parts procurements:

Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest

Solder type:

Leaded
Lead-free/ROHS compliant

Other capabilities:

Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.