Multilayer PCB high quality FR4 94V-0 PCB board manufacturer in China
Multilayer PCB Promotion
- 12% discount for multilayer PCBs
- more surprises for regular customers
Advantages
- No MOQ
- OEM services provided
- Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable
- Factory direct price
- Replying with price in one working day
- Shipping within 24 hours
- Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free
PCB Capacity
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PCB General Capability |
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Number of Layer |
1 - 18 Layer |
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Maximum Processing Area |
680 × 1000MM |
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Min Board Thickness |
2 Layer - 0.3MM ( 12 mil ) |
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4 Layer - 0.4MM ( 16 mil ) |
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6 Layer - 0.8MM ( 32 mil ) |
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8 Layer - 1.0MM ( 40 mil) |
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10 Layer - 1.1MM ( 44 mil ) |
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12 Layer - 1.3MM ( 52 mil ) |
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14 Layer - 1.5MM ( 59 mil ) |
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16 Layer - 1.6MM ( 63 mil ) |
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18 Layer - 1.8MM ( 71 mil ) |
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Finished Board Thickness Tolerance |
Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
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1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
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Twisting and Bending |
≤ 0.75%, Min: 0.5% |
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Range of TG |
130 - 215 ℃ |
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Impedance Tolerance |
± 10%, Min: ± 5% |
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Hi-Pot Test |
Max: 4000V/10MA/60S |
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Surface Treatment |
HASL, With Lead, HASL Free Lead |
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Flash Gold, Immersion Gold |
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Immersion Silver, Immersion Tin |
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Gold Finger, OSP |
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PCB Cu Thickness + Plating |
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Out Layer Cu Thickness |
1 - 6OZ |
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Inner Layer Cu Thickness |
0.5 - 4OZ |
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Cu Thickness of PTH |
20UM ≤ Average ≤ 25UM |
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Min: 18UM |
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HASL with Lead |
Tin 63% Lead 37% |
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HASL Free Lead |
7UM ≤ Surface Thickness ≤ 12UM |
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Thick Gold Plating |
Ni Thickness: 3 - 5UM ( 120u" - 200u" ) |
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Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" ) |
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Immersion Gold |
Ni Thckness: 3 - 5UM ( 120u" - 200u" ) |
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Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" ) |
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Immersion Silver |
Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" ) |
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Gold Finger |
Ni Thickness: 3 - 5UM ( 120u" - 160u" ) |
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Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" ) |
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U940 PCB Pattern Limit Capability |
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Min Width |
0.075MM ( 3 mil ) |
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Min Trace |
0.075MM ( 3 mil ) |
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Min Width of Ring ( Inner Layer ) |
0.15MM ( 6 mil ) |
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Min Width of Ring ( Out Layer ) |
0.1MM ( 4 mil ) |
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Min Solder Bridge |
0.1MM ( 4 mil ) |
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Min Height of Legend |
0.7MM ( 28 mil ) |
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Min Width of Legend |
0.15MM ( 6 mil ) |
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PCB Holes Processing Capability |
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Final Hole Size |
Min: Laser 0.1MM, Machine 0.2MM |
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Drilling Hole Size |
0.10 - 6.5MM |
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Drilling Tolerance |
NPTH: ±0.05MM, PTH: ±0.075MM |
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Final Hole Size Tolerance ( PTH ) |
φ0.20 - 1.60MM ± 0.075MM |
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φ1.60 - 6.30MM ± 0.10MM |
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Final Hole Size Tolerance ( NPTH ) |
φ0.20 - 1.60MM ± 0.05MM |
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φ1.60 - 6.50MM ± 0.05MM |
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Drilling Strip Hole |
-0L ~tu.'gth /width 2:1 |
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Min Strip Hole Width 0.65MM |
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Length & Width Tolerance ± 0.05MM |
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Board Thickness / Hole Size |
≤ 10:1 |
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PCB Cover Thickness Capability |
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Solder Mask Color |
Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White |
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Solder Mask Thickness |
Surface Line ≥ 10UM |
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Surface Line Corner ≥ 6UM |
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Surface Board 10 - 25UM |
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Solder Mask Bridge Width |
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Legend Color |
White,Yellow,Black |
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Min Height of Legend |
0.70MM ( 28 mil ) |
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Min Width of Legend |
0.15MM ( 6 mil ) |
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Blue Gel Thickness |
0.2 - 1.5MM |
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Blue Gel Tolerance |
±0.15MM |
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Carbon Print Thickness |
5 - 25UM |
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Carbon Print Min Space |
0.25MM |
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Carbon Print Impedance |
200Ω |
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Blind/Burried/Half Via PCB Capability |
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Parameters |
(1+1)e.g. (4-layer)blind via:1-2,2-4 (6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8 |
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Min Via |
Laser 0.1MM, Machine 0.2MM |
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Half Via |
Min: 0.6MM |
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Impedance Capability |
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Resistance Value |
Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω |
PCB Photos
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