Shenzhen Shinelink Technology Ltd

OEM PCB & PCBA Manufacturer (EMS Service)

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4 Layers Electronic Circuit Board Assembly SMT PCBA Prototype Board

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China Shenzhen Shinelink Technology Ltd certification
China Shenzhen Shinelink Technology Ltd certification
very nice service, price is competitive and reasonable, delivery is fast and on time, I like working with your company.

—— Ali

you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

—— David

Good quality with best service, Good job, Sandy !

—— Dan

So appreciate to Sandy, very fast delivery, good quality. I will order from you next month.

—— Sam

4 Layers Electronic Circuit Board Assembly SMT PCBA Prototype Board

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Large Image :  4 Layers Electronic Circuit Board Assembly SMT PCBA Prototype Board Get Best Price

Product Details:
Place of Origin: China
Brand Name: OEM and ODM
Certification: UL,RoHS, CE
Model Number: SL81023S005
Payment & Shipping Terms:
Minimum Order Quantity: 1pc
Price: Negotiable
Packaging Details: ESD package
Delivery Time: 5-7 days
Payment Terms: T/T, Western Union, MoneyGram,Paypal
Supply Ability: 100000pcs per day
Detailed Product Description
Packaging Details: Bubble Wrap Layer: 4 Layer
Board Thickness: 1.6mm Features 1: Gerber/PCB File Needed
Features 2: 100% E-test Features 3: Quality 2 Years Guarantee
High Light:

smt electronic assembly


smt pcba

Industrial Electronic SMT Pcb Assembly Custom Pcba Prototype Board



What Shinelink Company can do for you,

  • PCB & PCBA Design

  • PCB manufacturing (prototype, small to medium, mass production)

  • Components Sourcing

  • PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB

  • BOM List (Better with excel fomart)

  • Photoes of the PCBA (If you have done this PCBA before)


PCB Assembly Capability


Stencil Size


Minimum IC Pitch


Maximum PCB size

1200x 500mm

Minimum PCB thickness


Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:


BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)


One piece to low volume production quantities
Low cost first article builds
Schedule deliveries

Assembly type:

Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly

Components type:

Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch

Parts procurements:

Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest

Solder type:

Lead-free/ROHS compliant

Other capabilities:

Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.



PCBA Picture


4 Layers Electronic Circuit Board Assembly SMT PCBA Prototype Board 0

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Ms Xia

Tel: +8613590384973

Send your inquiry directly to us