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Shenzhen Shinelink Technology Ltd 86--13590384973 sandy@szshinelink.com
Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee

Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee

  • High Light

    smt electronic assembly

    ,

    smt pcba

  • Type
    PCBA Prototype
  • Components
    Qualified
  • SMT
    Support
  • Features 1
    Gerber/PCB File Needed
  • Features 2
    100% E-test
  • Features 3
    Quality 2 Years Guarantee
  • Place of Origin
    China
  • Brand Name
    OEM and ODM
  • Certification
    UL,RoHS, CE
  • Model Number
    SL81023S006
  • Minimum Order Quantity
    1pc
  • Price
    Negotiable
  • Packaging Details
    ESD package
  • Delivery Time
    5-7 days
  • Payment Terms
    T/T, Western Union, MoneyGram,Paypal
  • Supply Ability
    100000pcs per day

Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee

SMT Components Multilayer PCB Assembly Prototype Printed Circuit Board
 
 
LEAD TIME FOR PRODUCTION ORDERS
 

 

Sample Lead time

Mass production lead time

Single sided PCB

1~3

4~7

Double sided PCB

2~5

7~10

Multilayer PCB

7~8

10~15

PCB and Assembly

8~15

15~20

 
 
Features
 
1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available

 
 
PCB Assembly Capability
 

Stencil Size

736x736mm

Minimum IC Pitch

0.2mm

Maximum PCB size

1200x 500mm

Minimum PCB thickness

0.25mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Volume:

One piece to low volume production quantities
Low cost first article builds
Schedule deliveries

Assembly type:

Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly

Components type:

Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch

Parts procurements:

Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest

Solder type:

Leaded
Lead-free/ROHS compliant

Other capabilities:

Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.

 
 
PCBA Picture
 
Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee 0