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High Density Interconncection Multilayer Circuit Board 0.05mm NPTH Tolerance

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High Density Interconncection Multilayer Circuit Board 0.05mm NPTH Tolerance

China High Density Interconncection Multilayer Circuit Board 0.05mm NPTH Tolerance supplier
High Density Interconncection Multilayer Circuit Board 0.05mm NPTH Tolerance supplier High Density Interconncection Multilayer Circuit Board 0.05mm NPTH Tolerance supplier

Large Image :  High Density Interconncection Multilayer Circuit Board 0.05mm NPTH Tolerance

Product Details:

Place of Origin: China
Brand Name: OEM ODM
Certification: UL, Rohs
Model Number: SL81104S23

Payment & Shipping Terms:

Minimum Order Quantity: No MOQ
Price: Negotiation
Packaging Details: ESD Bag
Delivery Time: 5-7 days
Payment Terms: T/T, Western Union, MoneyGram,Paypal
Supply Ability: 30000pcs per day
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Detailed Product Description
Surface Finishing: ENIG+OSP Class Standard: IPC-6012 Class -II
NPTH Tolerance: +/-0.05mm Features 1: Gerber/PCB File Needed
Features 2: 100% E-test Features 3: Quality 2 Years Guarantee

High density interconncection Multilayer PCB Board Supplier in China

 

 

Multilayer PCB board

 

Production line process

 

Blank PCB


Material Cutting→Drilling→PTH→Photo process→Circuit Exposure→Etching→Touch up→Pannel plating→Plug hole→Print Solder mask ink→Surface Finish→Profile→Punch/V-cut→E-testing→→Final Visual Inspection→Packing

 

PCB Capacity

 

PCB General Capability

Number of Layer

1 - 18 Layer

Maximum Processing Area

680 × 1000MM

Min Board Thickness

2 Layer - 0.3MM ( 12 mil )

4 Layer - 0.4MM ( 16 mil )

6 Layer - 0.8MM ( 32 mil )

8 Layer - 1.0MM ( 40 mil)

10 Layer - 1.1MM ( 44 mil )

12 Layer - 1.3MM ( 52 mil )

14 Layer - 1.5MM ( 59 mil )

16 Layer - 1.6MM ( 63 mil )

18 Layer - 1.8MM ( 71 mil )

Finished Board Thickness Tolerance

Thickness ≤ 1.0MM, Tolerance: ± 0.1MM

1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%

Twisting and Bending

≤ 0.75%, Min: 0.5%

Range of TG

130 - 215 ℃

Impedance Tolerance

± 10%, Min: ± 5%

Hi-Pot Test

Max: 4000V/10MA/60S

Surface Treatment

HASL, With Lead, HASL Free Lead

Flash Gold, Immersion Gold

Immersion Silver, Immersion Tin

Gold Finger, OSP

PCB Cu Thickness + Plating

Out Layer Cu Thickness

1 - 6OZ

Inner Layer Cu Thickness

0.5 - 4OZ

Cu Thickness of PTH

20UM ≤ Average ≤ 25UM

Min: 18UM

HASL with Lead

Tin 63% Lead 37%

HASL Free Lead

7UM ≤ Surface Thickness ≤ 12UM

Thick Gold Plating

Ni Thickness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )

Immersion Gold

Ni Thckness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )

Immersion Silver

Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )

Gold Finger

Ni Thickness: 3 - 5UM ( 120u" - 160u" )

Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )

U940 PCB Pattern Limit Capability

 

Min Width

0.075MM ( 3 mil )

Min Trace

0.075MM ( 3 mil )

Min Width of Ring ( Inner Layer )

0.15MM ( 6 mil )

Min Width of Ring ( Out Layer )

0.1MM ( 4 mil )

Min Solder Bridge

0.1MM ( 4 mil )

Min Height of Legend

0.7MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

PCB Holes Processing Capability

Final Hole Size

Min: Laser 0.1MM, Machine 0.2MM

Drilling Hole Size

0.10 - 6.5MM

Drilling Tolerance

NPTH: ±0.05MM, PTH: ±0.075MM

Final Hole Size Tolerance ( PTH )

φ0.20 - 1.60MM ± 0.075MM

φ1.60 - 6.30MM ± 0.10MM

Final Hole Size Tolerance ( NPTH )

φ0.20 - 1.60MM ± 0.05MM

φ1.60 - 6.50MM ± 0.05MM

Drilling Strip Hole

-0L ~tu.'gth /width 2:1

Min Strip Hole Width 0.65MM

Length & Width Tolerance ± 0.05MM

Board Thickness / Hole Size

≤ 10:1

PCB Cover Thickness Capability

Solder Mask Color

Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White

Solder Mask Thickness

Surface Line ≥ 10UM

Surface Line Corner ≥ 6UM

Surface Board 10 - 25UM

Solder Mask Bridge Width

Legend Color

White,Yellow,Black

Min Height of Legend

0.70MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

Blue Gel Thickness

0.2 - 1.5MM

Blue Gel Tolerance

±0.15MM

Carbon Print Thickness

5 - 25UM

Carbon Print Min Space

0.25MM

Carbon Print Impedance

200Ω

Blind/Burried/Half Via PCB Capability

 

Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8

Min Via

Laser 0.1MM, Machine 0.2MM

Half Via

Min: 0.6MM

Impedance Capability

Resistance Value

Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

 

 

PCB Photos

 

High Density Interconncection Multilayer Circuit Board 0.05mm NPTH ToleranceHigh Density Interconncection Multilayer Circuit Board 0.05mm NPTH Tolerance

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Ms Xia

Tel: +8613590384973

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