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Shenzhen Shinelink Technology Ltd 86--13590384973 sandy@szshinelink.com
1OZ Thickness Turnkey PCB Assembly , PCB Printed Circuit Board Assembly With UL

1OZ Thickness Turnkey PCB Assembly , PCB Printed Circuit Board Assembly With UL

  • High Light

    circuit board assembly

    ,

    printed circuit board production

  • Copper Thickness
    1OZ
  • Board Thickness
    1.2mm
  • Based Material
    Rigid FR4
  • Max. Board Thickness
    12mm
  • Min. Board Thickness
    0.3mm
  • Min. Trace Width
    0.075mm
  • Surface Finishing
    HASL Lead Free
  • Warranty
    2 Years
  • Certificate
    UL, Rohs
  • Test Service
    AOI/X-RAY
  • Place of Origin
    China
  • Brand Name
    OEM/ODM
  • Certification
    UL,ROhs, CE
  • Model Number
    SL91030S003
  • Minimum Order Quantity
    1pc
  • Price
    USD1-10/PC
  • Packaging Details
    ESD package
  • Delivery Time
    5-7 days
  • Payment Terms
    T/T, Western Union, MoneyGram,Paypal
  • Supply Ability
    1000 0000 000pcs per month

1OZ Thickness Turnkey PCB Assembly , PCB Printed Circuit Board Assembly With UL

Turnkey pcb manufacturing PCB printed circuit board assembly OEM with UL

 

Shinelink  is an Electronic Manufacturing Service (EMS) provider. Our company is located in Shenzhen, China. Our operations have been accredited ISO 9001:2008, ISO 13485:2003, ISO 14001:2004 ,IATF16949,and IPC-A-610 Class II and III. Offering complete end-to-end manufacturing solutions including material procurement, PCB fabrition, PCBA, box-building, system level test,cable and other parts .
Owing over 20 years experience in manufacturing ,we have gained a good reputation in this industry.


Our products are applied abroadly, like medical and health care, industrial control, and automotive electronics, wireless communication. 

 

 

PCB or PCB Assembly files requests

1. Gerber files of the bare PCB board
2. BOM (Bill of material) for assembly

To short the lead time, please kindly advise us if there is any acceptable components substitution.
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Schematic if necessary

 

1.Bare Printed Circuit Board process capability:

 

1 Layers Single Sided,2 to 20 Layer
2 Board material type FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more
3 Compound material lamination 4 to 6 layers
4 Maximum dimension 610 x 1,100mm
5 Dimension tolerance ±0.13mm
6 Board thickness coverage 0.2 to 6.00mm
7 Board thickness tolerance ±10%
8 DK thickness 0.076 to 6.00mm
9 Minimum line width 0.10mm
10 Minimum line space 0.10mm
11 Outer layer copper thickness 8.75 to 175µm
12 Inner layer copper thickness 17.5 to 175µm
13 Drilling hole diameter (mechanical drill) 0.25 to 6.00mm
14 Finished hole diameter (mechanical drill) 0.20 to 6.00mm
15 Hole diameter tolerance (mechanical drill) 0.05mm
16 Hole position tolerance (mechanical drill) 0.075mm
17 Laser drill hole size 0.10mm
18 Board thickness and hole diameter ratio 10:1
19 Solder mask type Green, Yellow, Black, Purple, Blue, White and Red
20 Minimum solder mask Ø0.10mm
21 Minimum size of solder mask separation ring 0.05mm
22 Solder mask oil plug hole diameter 0.25 to 0.60mm
23 Impedance control tolerance ±10%
24 Surface finish Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger

 

♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.

 

 

2.PCB (PCB Assembly) process capability:

 

Technical Requirement Professional Surface-mounting and Through-hole soldering Technology
Various sizes like 1206,0805,0603 components SMT technology
ICT(In Circuit Test),FCT(Functional Circuit Test) technology
PCB Assembly With UL,CE,FCC, RoHS Approval
Nitrogen gas reflow soldering technology for SMT
High Standard SMT&Solder Assembly Line
High density interconnected board placement technology capacity
Quote&Production Requirement Gerber File or PCB File for Bare PCB Board Fabrication
BOM (Bill of Material) for Assembly,PNP (Pick and Place file) and Components Position also needed in assembly
To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders.
Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate
OEM/ODM/EMS Services PCBA, PCB assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
Other PCB Assembly Equipment SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
Reflow Oven: FL-RX860
Wave Soldering Machine: ADS300
Automated Optical Inspection (AOI): ALD-H-350B,X-RAY Testing Service
Fully Automatic SMT Stencil Printer: Win-5

 

 

1OZ Thickness Turnkey PCB Assembly , PCB Printed Circuit Board Assembly With UL 01OZ Thickness Turnkey PCB Assembly , PCB Printed Circuit Board Assembly With UL 1