Shenzhen Shinelink Technology Ltd

OEM PCB & PCBA Manufacturer (EMS Service)

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Good quality Turnkey PCB Assembly for sales
Good quality Turnkey PCB Assembly for sales
very nice service, price is competitive and reasonable, delivery is fast and on time, I like working with your company.

—— Ali

you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

—— David

Good quality with best service, Good job, Sandy !

—— Dan

So appreciate to Sandy, very fast delivery, good quality. I will order from you next month.

—— Sam

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Shenzhen Shinelink Technology Ltd

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Shenzhen Shinelink Technology Ltd Shenzhen Shinelink Technology Ltd Shenzhen Shinelink Technology Ltd Shenzhen Shinelink Technology Ltd
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Company Details:

Business Type : Manufacturer
Trading Company
Main Market : North America
South America
Western Europe
Eastern Europe
Southeast Asia
Africa
Oceania
No. of Employees : 250~300
Annual Sales : 8 million-10 million
Year Established : 2005
Export p.c : 60% - 70%
Domestic: 30% - 40%

The Leading Printed Circuit Board Manufacturer and PCB Assembly- Shinelink Technology Ltd

 

Shinelink Technology Ltd is a professional PCB and PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services, as PCB design, PCB fabrication, components procurement, SMT and DIP assembly, IC pre-programming / burning on-line, testing, packing.

 

PCB capability and services

 

1. Single-sided, double-sided and multi-layer PCB (up to 20 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3, FR-4, High TG FR-4, Polyimide, Aluminum/Metal-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

 

PCB Assembly services

 

SMT Assembly

Automatic Pick and Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

 

Through-hole Assembly

Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

 

Conformal coating

Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.

 

Complete Box build

Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

 

 

Testing Methods
 

AOI Testing

Checks for solder paste

Checks for components down to 0201"

Checks for missing components, offset, incorrect parts, polarity


X-Ray Inspection

X-Ray provides high-resolution inspection of:

BGAs

Bare boards


In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.

Power-up Test

Advanced Function Test

Flash Device Programming

Functional testing

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Ms. Sandy

Tel: 86-755-23592915

Fax: 86-755-23592915

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