Shenzhen Shinelink Technology Ltd 86--13590384973 sandy@szshinelink.com
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

  • High Light

    electronics prototyping board

    ,

    prototype printed circuit board

  • Copper Thickness
    4OZ
  • Surface Finish
    Immersion Tin, Silver
  • Certificate
    UL, RoHS
  • Features 1
    Gerber/PCB File Needed
  • Features 2
    100% E-test
  • Features 3
    Quality 2 Years Guarantee
  • Place of Origin
    China
  • Brand Name
    OEM and ODM
  • Certification
    UL,RoHS, CE
  • Model Number
    SL80815S002
  • Minimum Order Quantity
    1pc
  • Price
    Negotiable
  • Packaging Details
    ESD package
  • Delivery Time
    5-7 days
  • Payment Terms
    T/T, Western Union, MoneyGram,Paypal
  • Supply Ability
    1000pcs per day

Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

Thick copper 4OZ FR4 printed circuit board Prototype Immersion Tin / Silver

 

 

4OZ FR4 PCB Specifications

 

Thick copper printed circuit board
a). Impressive Quality
b). Fast Lead Time
c). Good Service

 

Thick copper printed circuit board

Process Capability

 

 

ltem

Mass Production

Prototype

 

Surface Treatment

HASL(LF)

HASL(LF)

Immersion Gold

Immersion Gold

Flash Gold

Flash Gold

OSP

OSP

Immersion Tin

Immersion Tin

Immersion Silver

Immersion Silver

HASL&Gold Finger

HASL&Gold Finger

selective nickel

selective nickel

HASL(LF)

smt Pad:>3um

smt Pad:>4um

Big Cu:>lum

Big Cu:>l.5um

Immersion Tin

0.4-0.8um

0.8-1.2um

Immersion Gold

Ni:2-5urn

Ni:3-6urn

Au:0.05-0.10um

Au:0.075-0.15um

Immersion Silver

0.2-0.6um

0.3-0.6um

OSP

0.1-0.4um

0.25-0.4um

Flash Gold

Ni:3-6urn

Ni:3-6urn

Au:0.01-0.05um

Au:0.02-0.075um

Laminates

CEM-3,PTFE

CEM-3,PTFE

FR4 (HighTG etc)

FR4(HighTG etc)

Metal Base(AL,CUetc)

Metal Base(AL,CUetc)

Rogors,etc

Rogors,etc

MAX.Layers

12(Layers)

40(Layers)

MAX.Board Size

20"X48"

20"X48"

Board Thickness

O.4mm~6.0mm

<O.4mm or >8.0mm

Max.Copper Thickness

inner Layer:16oz

inner Layer:16oz

Outer Layer:16oz

Outer Layer:16oz

Min.Track Width

3mil/0.075mm

3mil/0.075mm

Min.Track Space

3mil/0.075mm

3mil/0.075mm

M.in Hole Size

8mil/0.2mm

6mil/0.1mm

M.in Laser Hole Size

4mil/0.1mm

3mil/0.076mm

PTH Wall Thickness

0.8mil/20um

1.2mil/30um

PTH Dia.Tolerance

±2mil/±50um

±2mil/±50um

Aspect Ratio

12:1

15:1

lmpedance Control

±5%

±5%

 

 

PCBA Technology Capability

 

· Smallest chip placement:0201

· Automated axial insertion and Automated radial insertion

· Computer controlled Pb free wave soldering system

· High speed Pb free surface mount production lines

· Providing electronic components purchase service for the customers

· ICT on line inspection, PCBA function test equipment, Visual inspection

 

 

Mould And Box build Service

 

· Box Build

· Plastic injection

· Finish Packaging

 

 

PCB Picture

 

Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver 0