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FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services

FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services

  • High Light

    prototype pcb board


    electronics prototyping board

  • Based Material
  • PCB Layers
    1-18 Layers
  • Copper Thickness
    1/3 Oz - 6 Oz
  • Features 1
    Gerber/PCB File Needed
  • Features 2
    100% E-test
  • Features 3
    Quality 2 Years Guarantee
  • Place of Origin
  • Brand Name
    OEM and ODM
  • Certification
    UL,RoHS, CE
  • Model Number
  • Minimum Order Quantity
  • Price
  • Packaging Details
    ESD package
  • Delivery Time
    5-7 days
  • Payment Terms
    T/T, Western Union, MoneyGram,Paypal
  • Supply Ability
    1000pcs per day

FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services

FR4 glass epoxy PCB Circuit Board 1 - 18 layers , 1/3 oz - 6 oz





FR4 glass epoxy PCB Circuit Board

1.China PCB Factory,not Trading Company
2.No MOQ
3.24 hours for Quote
4.Deliver on Time


We can manufacture PCB and LED PCB in high quality, more competitive price, quicker delivery and better after-sale service.



Quick Details


Place of Origin:

China (Mainland)

Brand Name:


Model Number:


Base Material:

FR4,CEM-1,CEM-3,Teflon,Rogers,Aluminium,High Tg

Copper Thickness:

1/3 oz- 6 oz

Board Thickness:

0.2 mm - 6.0 mm

Min. Hole Size:

0.2 mm

Min. Line Width:

3 mil

Min. Line Spacing:

3 mil

Surface Finishing:

HASL,LF HASL,ENIG,Gold Finger,Flash Gold,OSP,Carbon,Peelable Mask


2 - 12 layers

Solder Mask:

All kinds of Color

Impedance Control:

+/- 10%


FR4 glass epoxy PCB Circuit Board



PCB Capability



1-18 layers

Board thickness

0.2-6.0 mm

Laminates type

FR-4, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Rogers, Aluminium, Tg130(150,170,180, 210), Berquist, Thermagon, Alon.Polyclad

Base copper thickness

Min: 12um (1/3oz)

Max: 140um (4oz) for inner layer;

210um (6oz) for outer layer

Min finished hole size

By mechanical drilling: 0.2mm (0.008")

Aspect ratio


Max panel size

Mass production: 540mm × 740m (21.25" × 29.13")

Sample: 540mm × 1100mm (21.25" × 43.3")

Min line width/space

3 mil/3 mil

Via hole type

Blind, Burried

Surface finish

HASL/ Lead Free HASL,

Immersion Gold / Silver / Tin,

Flash Gold, Hard Gold plating, Selective thick Gold Plating,

Gold Finger (Gold thickness up to 3um),

Plating Silver,

Carbon ink, Peelable mark, OSP

Solder mask

All kinds of colour,

LPI, Dry Film,

Min S/M pitch (LPI): 0.1mm

Impedance Control

Single trace or differential controlled

50, 60, 70, 100, 110, 120, 130 ±10%

Min bonding pitch

0.181mm (center to center)

Min SMT pitch

0.400mm (center to center)

Min annular ring


Outline finish type

CNC Routing; V-Scoring/Cut; Punch


Min Hole registration tolerance (NPTH) ± 0.025mm

Min Hole registration tolerance (PTH) ± 0.075mm

Min Pattern registration tolerance ± 0.05mm

Min S/M registration tolerance (LPI) ± 0.075mm

Scoring Lines ± 0.15mm

Board thickness (0.1 -1.0mm ) ±15%

Board thickness (1.0 -6.35mm ) ±10%

Board Size Routed ± 0.13mm

Board Size Scored ± 0.2mm

Electrical Testing

Voltage: 10V - 250V

Continuity: 10 - 1000 Ohms



PCB Picture


FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services 0