Shenzhen Shinelink Technology Ltd 86--13590384973 sandy@szshinelink.com
FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services

FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services

  • High Light

    prototype pcb board

    ,

    electronics prototyping board

  • Based Material
    FR4
  • PCB Layers
    1-18 Layers
  • Copper Thickness
    1/3 Oz - 6 Oz
  • Features 1
    Gerber/PCB File Needed
  • Features 2
    100% E-test
  • Features 3
    Quality 2 Years Guarantee
  • Place of Origin
    China
  • Brand Name
    OEM and ODM
  • Certification
    UL,RoHS, CE
  • Model Number
    SL80815S003
  • Minimum Order Quantity
    1pc
  • Price
    Negotiable
  • Packaging Details
    ESD package
  • Delivery Time
    5-7 days
  • Payment Terms
    T/T, Western Union, MoneyGram,Paypal
  • Supply Ability
    1000pcs per day

FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services

FR4 glass epoxy PCB Circuit Board 1 - 18 layers , 1/3 oz - 6 oz

 

 

Specifications

 

FR4 glass epoxy PCB Circuit Board


1.China PCB Factory,not Trading Company
2.No MOQ
3.24 hours for Quote
4.Deliver on Time

 

We can manufacture PCB and LED PCB in high quality, more competitive price, quicker delivery and better after-sale service.

 

 

Quick Details

 

Place of Origin:

China (Mainland)

Brand Name:

OEM

Model Number:

E020

Base Material:

FR4,CEM-1,CEM-3,Teflon,Rogers,Aluminium,High Tg

Copper Thickness:

1/3 oz- 6 oz

Board Thickness:

0.2 mm - 6.0 mm

Min. Hole Size:

0.2 mm

Min. Line Width:

3 mil

Min. Line Spacing:

3 mil

Surface Finishing:

HASL,LF HASL,ENIG,Gold Finger,Flash Gold,OSP,Carbon,Peelable Mask

Layer:

2 - 12 layers

Solder Mask:

All kinds of Color

Impedance Control:

+/- 10%

Product:

FR4 glass epoxy PCB Circuit Board

 

 

PCB Capability

 

Layer

1-18 layers

Board thickness

0.2-6.0 mm

Laminates type

FR-4, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Rogers, Aluminium, Tg130(150,170,180, 210), Berquist, Thermagon, Alon.Polyclad

Base copper thickness

Min: 12um (1/3oz)

Max: 140um (4oz) for inner layer;

210um (6oz) for outer layer

Min finished hole size

By mechanical drilling: 0.2mm (0.008")

Aspect ratio

8:1

Max panel size

Mass production: 540mm × 740m (21.25" × 29.13")

Sample: 540mm × 1100mm (21.25" × 43.3")

Min line width/space

3 mil/3 mil

Via hole type

Blind, Burried

Surface finish

HASL/ Lead Free HASL,

Immersion Gold / Silver / Tin,

Flash Gold, Hard Gold plating, Selective thick Gold Plating,

Gold Finger (Gold thickness up to 3um),

Plating Silver,

Carbon ink, Peelable mark, OSP

Solder mask

All kinds of colour,

LPI, Dry Film,

Min S/M pitch (LPI): 0.1mm

Impedance Control

Single trace or differential controlled

50, 60, 70, 100, 110, 120, 130 ±10%

Min bonding pitch

0.181mm (center to center)

Min SMT pitch

0.400mm (center to center)

Min annular ring

0.025mm

Outline finish type

CNC Routing; V-Scoring/Cut; Punch

Tolerances

Min Hole registration tolerance (NPTH) ± 0.025mm

Min Hole registration tolerance (PTH) ± 0.075mm

Min Pattern registration tolerance ± 0.05mm

Min S/M registration tolerance (LPI) ± 0.075mm

Scoring Lines ± 0.15mm

Board thickness (0.1 -1.0mm ) ±15%

Board thickness (1.0 -6.35mm ) ±10%

Board Size Routed ± 0.13mm

Board Size Scored ± 0.2mm

Electrical Testing

Voltage: 10V - 250V

Continuity: 10 - 1000 Ohms

 

 

PCB Picture

 

FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services 0