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Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel

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very nice service, price is competitive and reasonable, delivery is fast and on time, I like working with your company.

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you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

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Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel

Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel
Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel

Large Image :  Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel Get Best Price

Product Details:
Place of Origin: China
Brand Name: OEM ODM
Certification: UL, Rohs
Model Number: SL81104S19
Payment & Shipping Terms:
Minimum Order Quantity: No MOQ
Price: Negotiation
Packaging Details: ESD Bag
Delivery Time: 5-7 days
Payment Terms: T/T, Western Union, MoneyGram,Paypal
Supply Ability: 30000pcs per day
Detailed Product Description
Profiling Punching: V-cut,Rounting,Beveling Surface: Immersion Gold
Number Of Layer: 10 Layers Features 1: Gerber/PCB File Needed
Features 2: 100% E-test Features 3: Quality 2 Years Guarantee
High Light:

multilayer circuit board

,

multilayer printed circuit board

Multilayer PCB Board prototype 10 layers electronic circuit board

 

 

Multilayer 10 layers PCB board

 

The high technology as a starting point,the use of first-class equipment and raw material production and sales of high precision ,high density multi-layer LCD as our products and technology development direction,build up the company:"linePossess first-class PCB enterprise"as our vision ,to provide high quality electronic information industry PCB production Satisfactory products and sincere service" as our mission.

 

Advantages

 

- No MOQ

- OEM services provided

- Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable

- Factory direct price

- Replying with price in one working day

- Shipping within 24 hours

- Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

 

 

PCB Capacity

 

PCB General Capability

Number of Layer

1 - 18 Layer

Maximum Processing Area

680 × 1000MM

Min Board Thickness

2 Layer - 0.3MM ( 12 mil )

4 Layer - 0.4MM ( 16 mil )

6 Layer - 0.8MM ( 32 mil )

8 Layer - 1.0MM ( 40 mil)

10 Layer - 1.1MM ( 44 mil )

12 Layer - 1.3MM ( 52 mil )

14 Layer - 1.5MM ( 59 mil )

16 Layer - 1.6MM ( 63 mil )

18 Layer - 1.8MM ( 71 mil )

Finished Board Thickness Tolerance

Thickness ≤ 1.0MM, Tolerance: ± 0.1MM

1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%

Twisting and Bending

≤ 0.75%, Min: 0.5%

Range of TG

130 - 215 ℃

Impedance Tolerance

± 10%, Min: ± 5%

Hi-Pot Test

Max: 4000V/10MA/60S

Surface Treatment

HASL, With Lead, HASL Free Lead

Flash Gold, Immersion Gold

Immersion Silver, Immersion Tin

Gold Finger, OSP

PCB Cu Thickness + Plating

Out Layer Cu Thickness

1 - 6OZ

Inner Layer Cu Thickness

0.5 - 4OZ

Cu Thickness of PTH

20UM ≤ Average ≤ 25UM

Min: 18UM

HASL with Lead

Tin 63% Lead 37%

HASL Free Lead

7UM ≤ Surface Thickness ≤ 12UM

Thick Gold Plating

Ni Thickness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )

Immersion Gold

Ni Thckness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )

Immersion Silver

Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )

Gold Finger

Ni Thickness: 3 - 5UM ( 120u" - 160u" )

Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )

U940 PCB Pattern Limit Capability

 

Min Width

0.075MM ( 3 mil )

Min Trace

0.075MM ( 3 mil )

Min Width of Ring ( Inner Layer )

0.15MM ( 6 mil )

Min Width of Ring ( Out Layer )

0.1MM ( 4 mil )

Min Solder Bridge

0.1MM ( 4 mil )

Min Height of Legend

0.7MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

PCB Holes Processing Capability

Final Hole Size

Min: Laser 0.1MM, Machine 0.2MM

Drilling Hole Size

0.10 - 6.5MM

Drilling Tolerance

NPTH: ±0.05MM, PTH: ±0.075MM

Final Hole Size Tolerance ( PTH )

φ0.20 - 1.60MM ± 0.075MM

φ1.60 - 6.30MM ± 0.10MM

Final Hole Size Tolerance ( NPTH )

φ0.20 - 1.60MM ± 0.05MM

φ1.60 - 6.50MM ± 0.05MM

Drilling Strip Hole

-0L ~tu.'gth /width 2:1

Min Strip Hole Width 0.65MM

Length & Width Tolerance ± 0.05MM

Board Thickness / Hole Size

≤ 10:1

PCB Cover Thickness Capability

Solder Mask Color

Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White

Solder Mask Thickness

Surface Line ≥ 10UM

Surface Line Corner ≥ 6UM

Surface Board 10 - 25UM

Solder Mask Bridge Width

Legend Color

White,Yellow,Black

Min Height of Legend

0.70MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

Blue Gel Thickness

0.2 - 1.5MM

Blue Gel Tolerance

±0.15MM

Carbon Print Thickness

5 - 25UM

Carbon Print Min Space

0.25MM

Carbon Print Impedance

200Ω

Blind/Burried/Half Via PCB Capability

 

Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8

Min Via

Laser 0.1MM, Machine 0.2MM

Half Via

Min: 0.6MM

Impedance Capability

Resistance Value

Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

 

 

PCB Photos

 

Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel 0Immersion Gold Surface Multilayer PCB Board Prototype 10 Layers Electronic Circuit Panel 1

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Ms Xia

Tel: +8613590384973

Send your inquiry directly to us