Shenzhen Shinelink Technology Ltd

OEM PCB & PCBA Manufacturer (EMS Service)

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PI Material Flexible Printed Circuit Board Double Sides 2.0oz Copper Thickness

Good quality Turnkey PCB Assembly for sales
Good quality Turnkey PCB Assembly for sales
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—— David

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PI Material Flexible Printed Circuit Board Double Sides 2.0oz Copper Thickness

China PI Material Flexible Printed Circuit Board Double Sides 2.0oz Copper Thickness supplier

Large Image :  PI Material Flexible Printed Circuit Board Double Sides 2.0oz Copper Thickness

Product Details:

Place of Origin: China
Brand Name: OEM / ODM
Certification: UL, ROhs
Model Number: SL80903S004

Payment & Shipping Terms:

Minimum Order Quantity: 1pc
Price: Negotiation
Packaging Details: ESD Bag
Delivery Time: 5-7 days
Payment Terms: T/T, Western Union, MoneyGram,Paypal
Supply Ability: 10000 Piece/Pieces per Day
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Detailed Product Description
Board Thickness: 0.11mm-0.5mm Service: OEM / ODM
Soldermask: Yellow PI Film Features 1: Gerber/PCB File Needed
Features 2: 100% E-test Features 3: 3 Years Guarantee

PI Material FPC double sides 2.0oz copper thickness flexible pcb

 

 

Number of layers: 2 layers
Material: FPC
Board thickness: 1.6mm
Surface plating: ENIG
Min Trace: 3mil
Silkscreen:White


With 14+ years of experience exporting PCBs overseas, We understands the needs of your business and welcomes the opportunity to serve you.

Shinelink Company philosophy is simple- Deliver quality printed circuit boards on time.
We are ISO 9001:2008 certified.
Our dedication to building a quality product is the centerpiece of our business policy.
We are committed to fulfilling our customers' on-going quality requirements through continuous improvements to all of our internal processes. Our quality management system ensures the highest operating standards at all levels.

 

 

Item

Mass production

Small batch production

Number of layers

UP TO 18L

UP TO L

Laminate type

FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more.

FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.

Maximum board size

610mm*1100mm

610mm*1100mm

Board thickness

0.1mm-7.00mm

<0.1mm and >7.00mm

Minimum line width/space

3.5mil(0.0875mm)

3mil(0.075mm)

Minimum line gap

+/-15%

+/-10%

Outer layer copper thickness

35um-175um

35um-210um

Inner layer copper thickness

12um-175um

12um-210um

Drilling hole size(Mechanical)

0.15mm-6.5mm

0.15mm-6.5mm

Finished hole size (Mechanical)

0.15mm-6.0mm

0.15mm-6.0mm

Board thickness hole size ratio

14:1

16:1

Board thickness tolerance(t=0.8mm)

±8%

±5%

Board thickness tolerance(t<0.8mm)

±10%

±8%

Min. grid line width

4mil(12, 18, 35um), 6mil(70um)

4mil(12, 18, 35um), 6mil(70um)

Min. grid spacing

6mil(12, 18, 35um), 8mil(70um)

6mil(12, 18, 35um), 8mil(70um)

Hole size tolerance(Mechanical)

0.05-0.075mm

0.05mm

Hole position tolerance(Mechanical)

0.005mm

0.005mm

Solder mask color

Green, Blue, Black, White, Yellow, Red, Grey etc.

Green, Blue, Black, White, Yellow, Red, Grey etc.

Impedance control tolerance

+/-10%

+/-8%

Min. distance between drilling to conductor(non-blind buried orifice)

8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L)

6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)

Min. Character width and height(35um base copper)

Line width: 5mil
Height: 27mil

Line width: 5mil; height: 27mil

Max. test voltage

500V

500V

Max. test current

200mA

200mA


Surface treatment

Flash Gold

0.025-0.075um

0.025-0.5um

Immersion Gold

0.05-0.1um

0.1-0.2um

Sn/Pb HASL

1-70um

1-70um

Lead-free HASL

1-70um

1-70um

Immersion Silver

0.08-0.3um

0.08-0.3um

OSP

0.2-0.4um

0.2-0.4um

Gold Finger

0.375um

>=1.75um

Hard Gold Plating

0.375um

>=1.75um

Immersion Sin

0.8um

 

V-Cut rest thickness tolerance

±0.1mm

±0.1mm


Outline profile

Chamfer

The angle type of the chamfer

30,45,60

Plug via hole

Max.size can be plugged

0.6mm

Largest NPTH hole size

6.5mm

>6.5mm

Largest PTH hole size

6.5mm

>6.5mm

Min. solder spacer ring

0.05mm

0.05mm

Min. solder bridge width

0.1mm

0.1mm

Drilling diameter

0.15mm-0.6mm

0.15mm-0.6mm

Min. pad diameter with hole

14mil( 0.15mm drilling)

12mil( 0.1mm laser)

Min. BGA pad diameter

10mil

8mil

Chemical ENIG gold thickness

0.025-0.1um(1-4U)

0.025-0.1um

Chemical ENIG nickel thickness

3-5um(120-200U)

3-5um

Min. resistance test

Ω

5

 

 

FPCB Picture

 

PI Material Flexible Printed Circuit Board Double Sides 2.0oz Copper Thickness

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Ms Xia

Tel: +8613590384973

Send your inquiry directly to us (0 / 3000)