Multilayer Flexible PCB Board Rigid-flex PCB Polyimide PCB 0.2mm thick
This is a type of 4 layer flexible printed circuit for the application of Wireless Intercom at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.
Flexible circuits are also used extensively in other applications and industries including:
Communications
Consumer Electronics
Automotive
Medical
Industrial
Aerospace
Military
Transportation
Parameter and data sheet
|
Max. Size of Flexible PCB |
600*400mm |
|
Max. Number of Layers |
8 |
|
Board Type |
Flexible PCB |
|
Board Thickness |
0.15mm |
|
Board Material |
PET 25µm |
|
Board Material Supplier |
Shengyi |
|
Tg Value of Board Material |
60℃ |
|
|
|
|
PTH Cu thickness |
≥20 µm |
|
Inner Iayer Cu thicknes |
N/A |
|
Surface Cu thickness |
35 µm |
|
|
|
|
Coverlay Colour |
Yellow Top / White Bottom |
|
Number of Coverlay |
2 |
|
Thickness of Coverlay |
25 µm |
|
Stiffener Material |
Polyimide |
|
Stiffener Thickness |
0.2mm |
|
|
|
|
Type of Silkscreen Ink |
IJR-4000 MW300 |
|
Supplier of Silkscreen |
TAIYO |
|
Color of Silkscreen |
Black |
|
Number of Silkscreen |
1 |
|
|
|
|
Peeling test of Coverlay |
No peelable |
|
Legend Adhesion |
3M 90℃ No peeling after Min. 3 times test |
|
|
|
|
Surface Finish |
Immersion Gold |
|
Thickness of Nickle/Gold |
Au: 0.03µm(Min.); Ni 2-4µm |
|
RoHS Required |
Yes |
|
Famability |
94-V0 |
|
|
|
|
Thermal Shock Test |
Pass, -25℃±125℃, 1000 cycles. |
|
Thermal Stress |
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
|
Function |
100% Pass electrical test |
|
Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
Flexible PCB / FPCB Applications
FPCBs are used widely in everyday technology and electronics in addition to high-end, complex completed components. Two of the most prominent examples of flexible circuit usage is in modern portable electronics, devices, hard disk drives and desktop printers.
FPCB Photo
Our products are sold all over the world, you can rest assured.
