PI Material FPC double sides 2.0oz copper thickness flexible pcb
Number of layers: 2 layers
Material: FPC
Board thickness: 1.6mm
Surface plating: ENIG
Min Trace: 3mil
Silkscreen:White
With 14+ years of experience exporting PCBs overseas, We understands the needs of your business and welcomes the opportunity to serve you.
Shinelink Company philosophy is simple- Deliver quality printed circuit boards on time.
We are ISO 9001:2008 certified.
Our dedication to building a quality product is the centerpiece of our business policy.
We are committed to fulfilling our customers' on-going quality requirements through continuous improvements to all of our internal processes. Our quality management system ensures the highest operating standards at all levels.
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Item |
Mass production |
Small batch production |
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Number of layers |
UP TO 18L |
UP TO L |
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Laminate type |
FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more. |
FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more. |
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Maximum board size |
610mm*1100mm |
610mm*1100mm |
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Board thickness |
0.1mm-7.00mm |
＜0.1mm and ＞7.00mm |
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Minimum line width/space |
3.5mil(0.0875mm) |
3mil(0.075mm) |
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Minimum line gap |
+/-15% |
+/-10% |
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Outer layer copper thickness |
35um-175um |
35um-210um |
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Inner layer copper thickness |
12um-175um |
12um-210um |
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Drilling hole size(Mechanical) |
0.15mm-6.5mm |
0.15mm-6.5mm |
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Finished hole size (Mechanical) |
0.15mm-6.0mm |
0.15mm-6.0mm |
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Board thickness hole size ratio |
14:1 |
16:1 |
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Board thickness tolerance(t=0.8mm) |
±8% |
±5% |
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Board thickness tolerance(t＜0.8mm) |
±10% |
±8% |
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Min. grid line width |
4mil(12, 18, 35um), 6mil(70um) |
4mil(12, 18, 35um), 6mil(70um) |
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Min. grid spacing |
6mil(12, 18, 35um), 8mil(70um) |
6mil(12, 18, 35um), 8mil(70um) |
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Hole size tolerance(Mechanical) |
0.05-0.075mm |
0.05mm |
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Hole position tolerance(Mechanical) |
0.005mm |
0.005mm |
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Solder mask color |
Green, Blue, Black, White, Yellow, Red, Grey etc. |
Green, Blue, Black, White, Yellow, Red, Grey etc. |
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Impedance control tolerance |
+/-10% |
+/-8% |
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Min. distance between drilling to conductor(non-blind buried orifice) |
8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L) |
6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L) |
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Min. Character width and height(35um base copper) |
Line width: 5mil |
Line width: 5mil; height: 27mil |
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Max. test voltage |
500V |
500V |
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Max. test current |
200mA |
200mA |
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Flash Gold |
0.025-0.075um |
0.025-0.5um |
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Immersion Gold |
0.05-0.1um |
0.1-0.2um |
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Sn/Pb HASL |
1-70um |
1-70um |
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Lead-free HASL |
1-70um |
1-70um |
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Immersion Silver |
0.08-0.3um |
0.08-0.3um |
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OSP |
0.2-0.4um |
0.2-0.4um |
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Gold Finger |
0.375um |
>=1.75um |
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Hard Gold Plating |
0.375um |
>=1.75um |
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Immersion Sin |
0.8um |
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V-Cut rest thickness tolerance |
±0.1mm |
±0.1mm |
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Chamfer |
The angle type of the chamfer |
30,45,60 |
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Plug via hole |
Max.size can be plugged |
0.6mm |
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Largest NPTH hole size |
6.5mm |
>6.5mm |
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Largest PTH hole size |
6.5mm |
>6.5mm |
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Min. solder spacer ring |
0.05mm |
0.05mm |
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Min. solder bridge width |
0.1mm |
0.1mm |
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Drilling diameter |
0.15mm-0.6mm |
0.15mm-0.6mm |
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Min. pad diameter with hole |
14mil( 0.15mm drilling) |
12mil( 0.1mm laser) |
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Min. BGA pad diameter |
10mil |
8mil |
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Chemical ENIG gold thickness |
0.025-0.1um(1-4U) |
0.025-0.1um |
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Chemical ENIG nickel thickness |
3-5um(120-200U) |
3-5um |
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Min. resistance test |
Ω |
5 |
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FPCB Picture
Our products are sold all over the world, you can rest assured.
